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Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
- Pickering Interfaces Inc.
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LXI EMR Low Thermal EMF Matrix 28x33
60-511-003
This high density 1-pole matrix has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Chamber/Pyroelectric Task
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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Vacuum Chuck Temperature Controlled Test Stations
These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Probe Station
ETCP1000
Installation of “Hot and cool chuck” - Sellectable chuck size : 4inch, 6inch. - Temperature variation : -193°C ~ 300°C (80K ~ 573K) - Additional requirements : Vacuum chamber, LN2 tank(Bombei), microscope, CCD camera, manipulators. - EPS500 is standard model in ETCP1000 probe station.
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Semi-Automatic Probe Station
P300A
The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Standard Probe Station Chucks & Accessories
In this test solutions section of our website we describe the expanding line of Abet PV IV probe stations for the growing variety of solar cell types and sizes being developed around the world. This page describes a line of vacuum chucks and accessories for top/bottom, top/top, and bottom/bottom solar cells from 3 x 3 mm to 300 x 300 mm. Probe stations for multiple device on a single substrate and multifunction probe stations are described further in the sections highlighted to the left of this page.
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Thermal Cameras
Excelitas designs and manufactures a range of medium and long range thermal cameras covering the MWIR and LWIR wavebands. All cameras utilize the latest sensor technologies and benefit from our proven pedigree in designing and manufacturing high performance optical modules and cameras for demanding surveillance, targeting, naval and C-UAS applications.
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Thermal Camera
Shenzhen UYIGAO Electronic Technology Co., Ltd
This is an infrared thermal imager that combines the functions of surface temperature measurement and real-time thermal imaging. The traditional thermal imaging camera needs to measure each component one by one, while this instrument does not need to. Therefore, it helps to save your time. Even the potential problems can be clearly displayed on the color screen which helps users quickly locate the central point to measure cursor and temperature.
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Thermal Platforms
Thermal Platforms are perfect for using conductive transfer to test components hot and cold, they work best for parts with a low or flat physical profile. They transfer heat outstandingly for programmed or very rapid heating and cooling transition times (that’s why they’re called hot plates or cold plates as well), and have a precise temperature control every time from cryogenic temperatures to extremely hot
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Thermal Anemometers
Thermal Anemometers for the measurement of air velocity. Devices are also known as Hot Wire Anemometers, and the instruments can come with telescopic as well as articulated 90° angled probes.
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Electrostatic chucks
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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Thermal Printer
DP-581H
It allows to print data without AC power by driven with built-in rechargeable battery, enables to use anywhere. Lithium-ion battery (6-cell, 11.1 V, 6000 mAh, 66.6 Wh)
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Thermal Load Boards
Thermal Engineering Associates, Inc.
A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.
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Thermal Imaging Camera
TI160 - P5
TI 160-P5 is a special thermal imaging camera for human body temperature measurement only. Its has Accurate temperature measurement, real-time imaging, ability to quickly lock the hot-spot. It is been widely used in airports, docks,railway stations, schools, shopping malls and other public places to check human body temperature abnormalities. Palmetto design, compact and lightweight, integrated visible light function. Reliable performance and accurate temperature measurement can effectively improve the efficiency of detection.
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Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Thermal Cabinets
AMETEK Sensors, Test & Calibration
We provide two models of high precision heating and cooling thermal cabinets; the TC540 heating cabinets (40°C to 300°C) and the TC550 heating and cooling thermal cabinets (-70°C to 300°C) used with liquid nitrogen for cooling.
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Thermal Vacuum Chamber
Telstar Vacuum Solutions offers innovative custom solutions in design, construction and installation of space simulation thermal vacuum chambers, specially developed to optimize testing efficiency.
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Thermal Imaging Range
Di-LOG Offer the full FLIR Thermal Imaging range. Contact us for more information and to book your on-site demonstration
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Thermal Transport
The thermal transport probe measures thermal conductivity and thermoelectric power (defined by the Seeback Coefficient). Electrical and thermal contacts are made to opposite ends of the sample allowing for customisation to suit the sample requirements of the user.
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HD Thermal Camera
T1010
The T1010 uses the power of FLIR Vision Processing™ to deliver detailed, smooth pictures with very little image noise. FLIR Vision Processing combines HD resolution, MSX®, and UltraMax® image enhancement with FLIR's proprietary adaptive filtering algorithms to produce brilliant thermal images with up to 3.1 million pixels. Plus, the T1010 is sensitive enough to detect temperature differences down to <20 mK, for clear, low-noise results that keep you from missing any potential issues during inspections. 1024 × 768 true HD resolution images, with thermal measurements up to 650°C (1202°F).
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Thermal Imager with App
testo 872
The testo 872 thermal imager is ideally suited for professional industrial and building thermography - at the same time it ensures your work is both quick and easy. It is versatile to use, for example in industrial and mechanical maintenance or for detecting structural defects. You can generate error-free and objectively comparable infrared images using its handy functions. The IFOV warner, testo -Assist and testo ScaleAssist mean you can avoid measurement errors and not only effortlessly achieve optimum setting of emissivity () and reflected temperature (RTC) for building thermography, but also of thermal image scale.
