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ASIC
Application Specific Integrated Circuits are application specific custom made ICs.
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I/O Expanders and Level Translators
ST’s Xpander family of general-purpose input/output port expanders are used to interface digital ASICs via a two-line bidirectional bus (I²C) . ST’s dual-supply level translators are used as interface between multi-voltage chipsets and system I/Os, ranging from 5.5 V down to 1.2 V.
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FPGA Image Processing (IP) Development Kit
ProcVision
Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).
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Complete IP Module
Scan Ring Linker SRL
The Scan Ring Linker SRLTM - is a complete IP module that can be easily embedded into a CPLD, FPGA or ASIC on a PCB to reduce the complexities and costs of designing 1149.1 (JTAG) test infrastructure for designs that use multiple scan rings. The SRL IP module links any number of scan rings (secondary scan paths) into a single high-speed test bus, which permits devices on secondary scan chains to be independently tested and configured through a single 1149.1 external interface.
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Power Management
Menlo’s family of custom power management ASICs are designed to make the Ideal Switch even easier to use, opening up new applications and markets.
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nductive Proximity Sensors
Millions of inductive proximity sensors are currently in use in virtually all industries. They detect metal objects without contact, and are characterized by a long service life and extreme ruggedness. With the latest ASIC technology, SICK's sensors offer the ultimate in precision and reliability. SICK can provide the right solution to meet your requirements every time – from cylindrical or rectangular standard sensors with single, double or triple operating distance, to special sensors for explosive zones and harsh environments. Our sensors are the intelligent, reliable route to implementing industry-specific and customized solutions to any task involving automation.
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Function Generators
Waveform : Sine, Triangle, Square, Pulse, Sawtooth, Ramp 0.2Hz-150MHz EXT Frequency Counter(Option : 1:6 GHz or 2.7GHz) Self made insert ASIC Function : Total, RPM, Period, LPF, COUPL(AC/DC), ATT(X10) Fast,High-Resolution, 8Digits LED display Internal or External AM,FM Modulation Internal or External Burst and Linear Sweep Countrol from 1 : 1 to 100:1 TTL/CMOS Leveled Square Wave Output Maximum Attenuation of 20 dB cna be obtained Output impedance : 50 INPUT SENSITMTYKHz Range : 100mVms, MHz Range : 300mVms SWEEP WIDTH : Variable from 1:1 -100:1 RATE : 0.5Hz - 50Hz(20ms-2s) INTERNAL : Linear Bilt-in 5digits Green LED display
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STP Engine (IP Core)
The Stream Transpose® (STP) engine is a reconfigurable processor (DRP: Dynamically Reconfigurable Processor) core that combines the flexibility of software and the speed of hardware. The firmware defining processing can be reconfigured in an instant, allowing an almost infinite variety of functions to be integrated into a system. A 40nm process is currently available for ASIC.
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Compact Photoelectric Sensor
CX-400 Ver.2
Panasonic Industrial Devices Sales Company of America
For the CX-400 Series, the user has a large selection of ultra compact Photoelectric Sensors at his disposal. The Series includes three thru-beam, five retro-reflective, four diffuse reflective and four trigonometric types with foreground/background suppression. With its new ASIC (application specific integrated circuit), the Sensors require up to 60% less energy than before.
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Verification IP's
SmartDV Technologies India Private Limited
We develop Verification Components, leveraging our rich experience in ASIC / SoC design verification and capabilities on high-level verification languages (HVLs). Our verification components are configurable, reusable plug-and-play verification solutions for standard interfaces based on HVL. We currently support SystemVerilog, Vera, SystemC, Specman E and Verilog. All our VIP''s are supported natively in SystemVerilog VMM, RVM, AVM, OVM, UVM, Verilog, SystemC, VERA, Specman E and non-standard verification env.
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Component Test and Analysis Laboratories
The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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GRIDSCAN 5000
Hydrogen Series
The H2scan GRIDSCAN 5000 Hydrogen Sensor pairs a high performance ASIC to H2scan’s field-proven solid-state hydrogen sensor. This stand-alone sensor system has been designed to provide precision hydrogen measurement, at a lower cost for the high-volume OEM or utilities. No calibrations or maintenance is needed for up to 10 years, and the GRIDSCAN 5000 is the lowest cost by thousands to any other available hydrogen DGA system. H2scan is the only company in the industry that can state retail sales of over 15,000 sensor systems worldwide with no after sale calibrations performed since 2012.
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PCI Express IP
Rambus silicon-proven, high-performance PCI Express® (PCIe®) 6.0, 5.0, 4.0 and earlier generation digital controllers are optimized for use in SoCs, ASICs and FPGAs. These market-leading solutions for high-performance interfaces address AI/ML, data center and edge applications.
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Hybrid Verification Platform
HES-DVM
HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Audio MEMS Sensors
An audio MEMS sensor is an electro-acoustic transducer housing a sensor (MEMS) and an application-specific integrated circuit (ASIC) in a single package.
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IF/RF Receivers
IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
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Digital Oscilloscope
MSO8000
The MSO8000 series digital oscilloscope is a mid- to high-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Motion Control Solutions
DDC offers a complete line of Synchro/Resolver instrument-grade cards and test equipment including angle position indication and simulation, plus a variety of hardware and software to meet today’s civil, military, and COTS/MOTS requirements. DDC is a leading supplier of Synchro/Resolver-to-Digital and Digital-to-Synchro/Resolver components—the smallest, most accurate synchro/resolver-to-digital and digital-to-synchro/resolver converters available today. Most of these single chip and hybrid converters are based on ASIC designs, yielding the most reliable and affordable converters ever offered, and are the building blocks for DDC’s card-level products.
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ASIC Testing
Silicon Turnkey Solution, Inc.
As ASIC designs increasingly become more complex, so does the testing process—in fact, it can even be the bottleneck that constrains the total design cycle time and therefore impacts time to market. Effective and accurate testing requires in-depth knowledge of the hardware design itself as well as the software skills to conceive and create the appropriate test programs.
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360 EC-ASIC
ASIC synthesis verification from RTL code to final netlist.Systematic design errors, introduced by automated design refinement tools, such as ASIC synthesis, can be hard to detect, and damaging if they make it into the final device. Formal Equivalency Checking (EC) has become a standard part of the ASIC development flow, replacing almost all gate level simulation with a rigorous consistency check between pre- and post-synthesized code.
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Transducer / Transmitter
General purpose industrial pressure transducer provides outstanding integrity concerning high shock, vibration and pressure cycling. Utilizing high-performance ASIC, digital compensation provides excellent temperature performance, while the thin film sensor enables long-term stability.
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Functional Testing
Functional Ethernet testing is done during the research and development phase of a product or service. It can cover many parameters depending on the DUT and the application. Using Xena’s products, your range of functional Ethernet testing includes:*Multicast*40/100G PCS and PMA Layer*Transparent Transport*Energy Efficient Ethernet (EEE)*Microbursts and random IFG*Synchronous Ethernet*Automotive Ethernet*1588v2 Performance Testing*Regression testing*Kernel drivers and NIC testing*Hardware emulation (ASIC*)
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EMBEDDED MMC (EMMC)
SD 3.0 / eMMC 4.51 IP Family
The eMMC Host IP is an RTL design in Verilog that implements an MMC / eMMC host controller in an ASIC or FPGA. The core includes RTL code, test scripts and a test environment for full simulation verifications. The Arasan MMC / eMMC Host IP Core has been widely used in different MMC applications by major semiconductor vendors with proven silicon.
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Digital Pattern Generator
Wave Gen Xpress
A digital pattern generator is an essential stimulus source for almost every type of digital device: digital and mixed-signal ASIC, FPGA, microprocessors and microcontrollers. The digital pattern generator can be used early in the design cycle to substitute for system components that are not yet available.
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Digital Solutions
Dexter's Digital Detectors and Temperature Sensor Modules (TSM's) are based on Dexter's superior silicon thermopile technology and incorporate an ASIC that provides a cost effective front end for reading out the detector output. The digital solutions include pre-amplification, A/D, multi-plexing and SMBus communications. Additionaly, the SMBus can accommodate communications with up to 100 digital products. Our digital solutions are housed in industry standard TO-5/TO-39 packages.
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Wafer Probe Test System
STI3000
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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PCI Express 5 Base Specification Receiver Test Automation
N5991PB5A
The N5991PB5A is the receiver test automation software for bit error ratio testers, allowing you to test and characterize PCI Express 5.0 ASICs
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The Intel® RealSense™ Depth Sensing Portfolio
Intel® RealSense™ offers a range of stereo vision cameras and modules, supported by an extensive open-source SDK. The D400 product line helps you ensure that you can add robust three-dimensional vision capability to your products or systems. The cameras feature an integrated ASIC that performs real-time depth calculation directly on the camera, saving you processing resources on the host system. The SDK allows you to further tune the depth data stream to your needs.
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360 EC-FPGA
Functional correctness of FPGA synthesis from RTL code to final netlist. Systematic design errors, introduced by automated design refinement tools, such as synthesis, can be hard to detect, and damaging if they make it into the final device. Formal equivalence checking has been used for ASIC design flows for many years. As FPGAs become bigger and critical system components, exhaustively verifying the functional equivalence of Register Transfer Level (RTL) code to synthesized netlists and the final placed & routed FPGA designs is mandatory.
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PCI Express 6 Base Specification Receiver Test Automation
N5991PB6A
The N5991PB6A is the receiver test automation software for bit error ratio testers, allowing you to test and characterize PCI Express 6.0 ASICs
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CompuScope GPU CUDA Processing
Performing real-time digital signal processing (DSP) routines such as Fast Fourier Transform (FFT), Signal Averaging, Finite Impulse Response (FIR) Filtering, Digital Down Conversion (DDC) and more have traditionally required the use of dedicated DSP processors, Field Programmable Gate Arrays (FPGAs), or Application Specific Integrated Circuits (ASICs).
