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Manufacturers
- Virginia Panel Corporation
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Tool, Inspection Depth Gauge, Mini Coax, ITA
910121157
Used to verify the depth setting of the center conductor of the ITA mini coax contacts.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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For Real-Time X-ray Inspection Systems
Image Processors
A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Digital In-Circuit tester
MTS180/300
Analog in-circuit inspection and function inspection are realized on this inspection equipment. IC pin float function is standard equipment. The MTS180 is a press type jig, and the MTS300 is a vacuum type jig. In the board mounting process at the production site, electrical inspection is performed on the mounted board after component mounting, and non-defective or defective products are automatically judged. The main inspection contents are short / open inspection, analog inspection of resistors, capacitors, coils, diodes, etc., lead floating voltage measurement of QFP and BGA, Digital IC inspection, frequency measurement.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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Making Invisible Visible
Quadra 3
Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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BGA Rework Station
PDR IR-E6 Evolution
The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Inspection
A complete line of testing instruments for inspection laboratories is available from our Petrolab group. We specialize in instruments for vapor pressure, flashpoint, distillation, and color as well as equipment for hundreds of other ASTM, ISO, and DIN testing procedures. Below are a handful of items we offer.
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IPC Inspection
Customers of MASER Engineering that are designing electronic products and thereby using bare and assembled Printed Circuit Boards (PCB's) are interested in the manufacturing quality of the PCB and assembling quality of the PCBA.
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Inspection Tools
Deca XG1040
SATA 3.0 Gbps interface supportedSATA 3.0 Gbps supported. Up to 144PB HDD is supported.Register and edit inspection details (operation modes)Operation modes can be registered and edited using script files in text format.More accurate inspections can be performed using various types of inspections.Provides high speed data transfer at 8GB/minute.(* Varies according to performance of connected HDD.)Deletion and quick diagnostics functionEquipped with overwrite deletion using specified values and DoD (Department of Defense) conforming deletion method.Quick inspections such as SMART status, random seek inspection, entire area read/write inspection can be performed.HDDs connected to each port can be executed, terminated, attached or removed individually.Multiple channels supportedUp to 16 HDDs can be operated by attaching 4 devices.
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Test & Inspection
Our test and inspection products support maintenance, product quality testing, diagnostics, and quality control. The extensive range of products covers almost any application need you to have.
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LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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In-Line Inspection
Mapvision | Q
Inspect ALL features for EACH part you manufature within your Takt time – even for the most complex components with hundreds of features.
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Inspection System
CIX100
The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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3D Inspection Service
The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Metrology & Inspection Systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Robotic Inspection Vehicle
Iris Power RIV800
The Iris Power RIV800 Robotic Inspection Vehicle and Camera System, allows a visual inspection of the generator stator and rotor, including checking the air vents for debris, with or without removing the rotor. The robotic inspection vehicle also provides an automated means of EL CID electromagnetic core imperfection detection testing and SWA stator wedge analyzer testing.
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MT Inspection Scope
Um
● Test 12 or 24 fiber MT Connectors● Find Endface defects fast● 800x Magnification●Numbered Dial Indicator to quickly identify which fiber you're onThe Um MT Inspection Scope accurately shows defects in your MT 12 or 24 fiber connectors. Quickly view each fiber to save time and money. Our unique Fiber Dial shows which fiber you are inspecting. No more getting lost!The Um MT is compatible with our Eagle Inspect Software. Create reports with images for your MT connectors.
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Inspection System
Pixie
3-D Metrology for automation. Pixie is a standard system for automated optical quality inspection. Pixie can be configured with 2 to 5 servo driven axis movement and the high-speed measurement capabilities make it suitable for inline and stand-alone solutions.
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Probes for Tube Inspection
Probes for tube inspection are lightweight but solidly constructed eddy current, remote field, magnetic flux leakage, and IRIS ultrasound. These probes are used for ferromagnetic or non-ferromagnetic tube inspection applications.
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X-Ray Inspection System
MXI Quadra 5
Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Inspection Scope
KI-TK1010
Inspection scope & cleaning materials for SC, FC, ST connectors, universal 2.5 mm & 1.25 mm ferrules (LC / 1.25 mm option)
