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S2 Spectra Sensors
ULP-S2 WBI/V
The ULP S2 Spectra Sensor tests for LED intensity, and for any color in the visual spectrum, plus white. The S2 Spectra Sensor is well-suited for the test of “boundary” color LEDs, as it can unambiguously and repeatedly distinguish between not only adjacent visual colors such as green and yellow, but it can determine different hues of the same color such as yellow and amber, regardless of LED intensity. Implemented in a unique and customizable 2-Part solution, the S2 Spectra Sensor is assembled with your choice of Fiber-Optic Probe, including for the test of densely-spaced LEDs, bright LEDs, dim or misaligned LEDs, right-angle LEDs, and more, including the popular “Trident” Fiber-Optic Probes to sequentially test 3 LEDs with a single Sensor.Operating temperature range: 0oC to 70oCPower consumption: Operates between +5 and 28 volts D.C., at 6mA max. Less than 4.75 volts is not recommendedVoltage protection: Withstands up to +40 volts, & reverse polarity to -18 voltsOutput Pins: 4 gold-plated standard wire-wrap pins (0.025 in. sq.)Output Loads: ‘Int.’& ‘Color’- 2Kohms min., 100pF max.Sensor Size: 0.560 in. dia x 1.38 in. long.Typical response time: Typical response time: <10mS capture time; <100mS overall response timefor color and intensity simultaneouslyFiber-Optic Probes: Can be paired with any Universal LightProbe Fiber-Optic Probe
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Image Sensor Testing
IP750Ex-HD Family
The IP750EX-HD has been the test platform that has enabled the industry to manufacture high quality CCD and CMOS image sensors, and it is the most economical platform to meet the needs of newer technologies such as Time of Flight (ToF) sensors. When you use a smartphone, high performance digital still camera, or in-home security and surveillance system, these applications have image sensors most likely tested by Teradyne’s IP750ExHD.
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Low-power, High-performance FPGA
iCE40 LP/HX
*Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications
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Charge Coupled Device (CCD) Image Sensors for Space and Ground-Based Astronomy
(CCDs) for Space science, Ground-based Astronomy, and Earth observation applications with an impressive record of successful deliveries to a wide range of customers over 40 years.All Teledyne e2v devices can be supplied partially or fully customised to fit the application and achieve the best possible system performance. CCD image sensor design, manufacture, test and characterisation are carried out in-house enabling control from start to finish. Multi-polysilicon, multi-metal and back-illumination options are available for high resolution, high sensitivity and very low noise.
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ISC-1780, VGA, 1.58 GHz Processor, Monochrome/Color Smart Camera
785142-01
The ISC‑1780 is a high-performance smart camera for machine vision and is powered by a 1.58 GHz dual-core Intel Celeron processor. The combination of the onboard processor with a CMOS image sensor provides an easily distributed all‑in‑one system. In addition to high-performance image acquisition and processing, you can use built-in digital I/O and industrial communication options for dynamic, real-time communication and integration with industrial automation devices including programmable logic controllers (PLCs), human machine interfaces (HMIs), robotics, sensors, and industrial machinery. You can configure NI Smart Cameras with the included Vision Builder for Automated Inspection (AI) software or program the camera with the LabVIEW Real‑Time Module and the Vision Development Module.
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CMOS Cameras
Magic series
New Imaging Technologies proposes a broad range of visible products. From sensors to complete camera systems, all of our products integrate our unique NATIVE WDR capabilities. Our NATIVE WDR™ is a new generation of CMOS imaging technology named MAGIC™ (standing in english for Active Matrix with indexed generated contrast ), capable of generating a highly stable image even under very wide intra scene dynamic range (> 120dB) in a single frame time and without multi-exposure, any setting of knee points or external control. Our products are suited for many demanding applications and industries.
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24 TTL Channels, Programmable I/O
TL1
Function module TL1 provides 24 channels of TTL/CMOS transceiver functionality as either inputs or outputs. The transistor-transistor logic (TTL) employs transmitters with multiple emitters in gates having more than one input. TTL offers high switching speed and relative immunity to noisy systems. CMOS sensors provide image sensing technology by converting light waves into signals that are small bursts of current. These waves can be light or other electromagnetic radiation.
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Charge Coupled Device (CCD) Standard Image Sensors
Teledyne e2v is the leading supplier of scientific grade Charge Coupled Device (CCD) image sensors for the most challenging low light imaging and spectroscopy applications.
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Equipment & Vision Systems for Surveillance & Defense Applications
Photonis equipment systems are designed with Photonis sensors and cameras, while providing ease-of-use for in-depth image capture and analysis. These low light imaging systems are specifically developed with Night Vision, Observation & surveillance, Situation Awareness in mind.Two main equipments are proposed: the TacFusion is a handheld binocular combining low light camera core and thermal imaging sensor and the SR750 is a long range surveillance camera with powerful zoom and adapted ergonomics for rapid deployment. Both devices can be used for surveillance applications (police law-enforcement, borders and infrastructure surveillance) as well as SAR operations.
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Contactless Video Extensometers
Jinan Testing Equipment IE Corporation
Deformation measurement of samples during material testing with use of the Video extensometer MercuryRT allows applying multiple virtual probes (Movement Sensors)on markers and advanced image featuresto be tracked, including the natural pattern of the sample surfaces.The common resolution of standard system is within 500 nm and 5 m. The system fulfils class 0.5 or B-1 of classification according to ISO 9513 and ASTM E83. In certain camera use case, the system resolution reaches the level of 100 nm - 500 nm and system fulfils the class 0.2. The strain resolution can reach 10 microstrains. Material testing,Component testing ,FEA validation,Vibrography .
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ISC-1780, VGA, 1.58 GHz Processor, Monochrome/Color Smart Camera
785143-01
The ISC‑1780 is a high-performance smart camera for machine vision and is powered by a 1.58 GHz dual-core Intel Celeron processor. The combination of the onboard processor with a CMOS image sensor provides an easily distributed all‑in‑one system. In addition to high-performance image acquisition and processing, you can use built-in digital I/O and industrial communication options for dynamic, real-time communication and integration with industrial automation devices including programmable logic controllers (PLCs), human machine interfaces (HMIs), robotics, sensors, and industrial machinery. You can configure NI Smart Cameras with the included Vision Builder for Automated Inspection (AI) software or program the camera with the LabVIEW Real‑Time Module and the Vision Development Module.
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SparkFun IR Array Breakout
55 Degree FOV, MLX90640 (Qwiic)
It's time to say hip hip array for this IR Breakout! The MLX90640 SparkFun IR Array Breakout is equipped with a 32x24 array of thermopile sensors creating, in essence, a low resolution thermal imaging camera. With this breakout you can detect surface temperatures from many feet away with an accuracy of ±1.5°C (best case). To make it even easier to get your infrared image, all communication is enacted exclusively via I2C, utilizing our handy Qwiic system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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3D vision
SICK's 3D vision series offers a wide range of powerful and flexible products designed for reliable operation in harsh industrial environments. They range from versatile high-speed cameras that deliver high quality 3D and contrast images to smart and configurable stand-alone sensors that facilitate rapid development and easy integration. Their scalability ensures a perfect fit with your 3D vision application.
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2D CMOS Image Sensors
Topaz
The Topaz series of industrial CMOS sensors include 2MP (1920 x 1080) and 1.5MP (1920 x 800) resolution devices. The sensors use state-of-the-art low noise, global-shutter pixel technology to offer powerful solutions and enable compact mobile designs for many applications.
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ISC-1783, 5 MP, 1.58 GHz Processor, Monochrome/Color Smart Camera
785153-01
The ISC‑1783 is a high-performance smart camera for machine vision and is powered by a 1.58 GHz dual-core Intel Celeron processor. The combination of the onboard processor with a CMOS image sensor provides an easily distributed all-in-one system. In addition to high-performance image acquisition and processing, you can use built-in digital I/O and industrial communication options for dynamic, real-time communication and integration with industrial automation devices including programmable logic controllers (PLCs), human machine interfaces (HMIs), robotics, sensors, and industrial machinery. You can configure NI Smart Cameras with the included Vision Builder for Automated Inspection (AI) software or program the camera with the LabVIEW Real‑Time Module and the Vision Development Module.
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Board Cameras
e-CAM & See3CAM Series of Camera Boards. e-CAM camera board is e-con's reference design featuring a board camera interfaced to a processor on its high speed CMOS interface. Board cameras are available for Jetson Developer kits and NXP i.MX6 boards. For processors, that don't have the Camera ISP pipeline, e-con Systems provides the complete software stack for raw image sensors. The software stack has a wide variety of features ranging from color correction, gamma correction, dead pixel correction, color space conversion, sharpen filter etc.
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Machine Vision Cameras
Manta Series
High-performance industrial cameras with a large choice of sensors, modular options and built-in image optimization. VGA to 12 Megapixels. CCD and CMOS (Sony, CMOSIS). Up to 125 fps. NIR versions, board level option.
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SparkFun IR Array Breakout
110 Degree FOV, MLX90640 (Qwiic)
It's time to say hip hip array for this IR Breakout! The MLX90640 SparkFun IR Array Breakout is equipped with a 32x24 array of thermopile sensors creating, in essence, a low resolution thermal imaging camera. With this breakout you can detect surface temperatures from many feet away with an accuracy of ±1.5°C (best case). To make it even easier to get your low-resolution infrared image, all communication is enacted exclusively via I2C, utilizing our handy Qwiic system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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3D Profile Sensor
Z-Trak2
Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Clock Drivers
Multiple timing signals ("clocks") are required by CCDs, IR FPAs, and some CMOS image sensors to transport electrical charge across the array to a sense amplifier for conversion into image data. Pulse Instruments offers a line of "clock drivers" for generating these timing signals. The parameters of these clocks (clock rate, pulse width, pulse amplitude, rise- and fall-times, etc.) greatly influence the behavior and performance of the imaging device. Our products take logic-level inputs from a pattern generator and allow the user to adjust the output parameters to suit their device and testing requirements. Clocks can be "tweaked" in real-time to determine optimal operating parameters for a particular device, or else programmed in accordance with a test plan for automated production test.
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ISC-1781, 1.3 MP, 1.58 GHz Processor, Monochrome/Color Smart Camera
785147-01
The ISC‑1781 is a high-performance smart camera for machine vision and is powered by a 1.58 GHz dual-core Intel Celeron processor. The combination of the onboard processor with a CMOS image sensor provides an easily distributed all‑in‑one system. In addition to high-performance image acquisition and processing, you can use built-in digital I/O and industrial communication options for dynamic, real-time communication and integration with industrial automation devices including programmable logic controllers (PLCs), human machine interfaces (HMIs), robotics, sensors, and industrial machinery. You can configure NI Smart Cameras with the included Vision Builder for Automated Inspection (AI) software or program the camera with the LabVIEW Real‑Time Module and the Vision Development Module.
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Miniature Camera Modules
The NanEye miniature CMOS image sensors and corresponding camera module configurations are available in modular form factors as small as 1 mm x 1mm. Various optics options are available.
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PCIe-6537B, 32-Channel, 50 MHz, 200 MB/s Digital I/O Device
782631-01
32-Channel, 50 MHz, 200 MB/s Digital I/O Device - The PCIe-6537 can continuously stream data over the PCI Express bus. It's an ideal solution for interfacing and testing image sensors or display panels. The module is also well-suited for other common digital applications such as pattern I/O, change detection, protocol emulation, or other custom digital interfacing. It features selectable voltage levels and per-channel directional control of the digital lines.
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Sensors And Cables
Sensors provide the vital link between the material under test and the instrument that measures its properties. Lambient Technologies LLC has developed a variety of disposable and reusable sensors for different applications. Click on the images below to learn more.
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Machine Vision Camera - 0.4 MP, 522 FPS, Sony IMX287, Color
Blackfly S USB3
The Blackfly® S leverages the industry’s most advanced sensors in an ice-cube form factor. It is packed with powerful features enabling you to easily produce the exact images you need and accelerate your application development. This includes both automatic and precise manual control over image capture and on-camera pre-processing. The Blackfly S is available in GigE, USB3, cased, and board-level versions.
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CMOS Image Sensor
CIS
CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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SWIR Cameras
Our SWIR or Short-Wave Infrared imaging covers the wavelength range from 900nm to 1700nm. A large number of applications that are difficult or impossible to perform using visible light are made possible, with great results, using short-wave infrared (SWIR) imaging thus enabling the user to "See Beyond the Visible". SWIR is similar to visible light in that photons are reflected or absorbed by an object, providing the strong contrast needed for higher resolution imaging– unlike thermal images, that rely on radiated photons. At NIT, we offer unique SWIR cameras and sensors, see below for more information on our products.
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3D Sensor
C6 Series
The new 3D C6 series by AT is built on a novel sensor platform that supports the latest industrial standard GigE Vision/GenICam 3D at 1 Gbit/s. These new laser profilers offer an impressive combination of extremely fast and highly precise resolution, reaching up to 4,096 points per profile, a profile speed of up to 200 kHz, and high dynamic range 3D image capture. They are available as compact sensors, MCS, and 3D cameras.
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Image Processing Module
IMP20
The IMP20 video processing mezzanine card significantly increases the ease of acquiring and interpreting images from multiple sensors and cameras, thus speeding reaction time and potentially saving lives. The card adds image fusion capabilities to Abaco Systems’ ADEPT104 and AIM12 automatic video trackers, and allows the design of highly integrated, high performance graphics capabilities in any environment where the input from multiple devices needs to be combined in order to provide a complete, easy-to-interpret image.
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Spectroradiometer
FieldSpec 4 Hi-Res NG
Analytical Spectral Devices, Inc.
Higher resolution hyperspectral sensors yield greater precision for remote sensing classification applications, producing more information from every pixel generated in an image than ever before. To help maximize the full potential of these next generation sensors, measurements from ground based instrumentation need to meet or exceed the sensor’s spectral resolution. In the absence of this resolution equality, data is interpolated during post processing and vital spectral information can be smoothed and lost.
